Patent Assignment
Reel/Frame 052229/0580
Assignment of Assignor's Interest
Recorded: 2020-03-25
Pages: 4
Assignors
YANG, CHING-FENG
Executed: 2020-03-11
PAN, HSIN-YU
Executed: 2020-03-13
WU, KAI-CHIANG
Executed: 2020-03-11
LIN, CHIEN-CHANG
Executed: 2020-03-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof