Patent Assignment
Reel/Frame 052248/0210
Assignment of Assignor's Interest
Recorded: 2020-03-27
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2019-10-09
KUO, LI-CHUNG
Executed: 2019-10-09
SHIH, YING-CHING
Executed: 2019-10-09
LU, SZU-WEI
Executed: 2019-10-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Thermal Interface Materials, 3D Semiconductor Packages and Methods of Manufacture