Patent Assignment
Reel/Frame 052257/0001
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 8
Assignors
LEE, HYUEKJAE
Executed: 2020-03-02
KIM, JIHOON
Executed: 2020-03-02
SUH, JIHWAN
Executed: 2020-03-03
LEE, SOYOUN
Executed: 2020-03-03
HONG, JISEOK
Executed: 2020-03-03
KIM, TAEHUN
Executed: 2020-03-03
HWANG, JIHWAN
Executed: 2020-03-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Stacked Semiconductor Chips