Patent Assignment
Reel/Frame 052257/0479
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 4
Assignors
SAITO, YUSUKE
Executed: 2020-03-16
KISHIMOTO, TAKAOMI
Executed: 2020-03-16
NAKANO, SIGEYUKI
Executed: 2020-03-16
Assignee
TANAKA KIKINZOKU KOGYO K. K.
7-3, MARUNOUCI 2-CHOME, CHIYODA-KU, TOKYO, 1006422, JAPAN
Covered Property
(1)
High Strength/Highly Conductive Copper Alloy Plate Material and Manufacturing Method Therefor