Patent Assignment
Reel/Frame 052261/0876
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 5
Assignors
YI, JAE SEOK
Executed: 2020-02-10
KIM, JUNG MIN
Executed: 2020-02-10
KOO, BON SEOK
Executed: 2020-02-10
CHOI, CHANG HAK
Executed: 2020-02-18
LEE, IL RO
Executed: 2020-02-10
KANG, BYUNG WOO
Executed: 2020-02-10
KYEONG, SAN
Executed: 2020-02-10
KANG, HAE SOL
Executed: 2020-02-10
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONNGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component Including Non-Conductive Resin Layer on Body Thereof