IP Library › Assignment 052262/0001
Patent Assignment
Reel/Frame 052262/0001

Assignment of Assignor's Interest

Recorded: 2020-03-30 Pages: 5
Assignors
PARK, CHAE MIN
Executed: 2020-03-11
JO, JI HONG
Executed: 2020-03-11
SHIN, WOONG
Executed: 2020-03-11
LEE, JAE HYUN
Executed: 2020-03-11
SEUNG, HYUN WOO
Executed: 2020-03-11
SHIN, WOO CHUL
Executed: 2020-03-11
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONNGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Electronic Component Having Moisture-Proof Layer on Body Thereof
Application: 16/834,243 →
Publication: US 2021/0090806
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of the Assignee City Previously Recorded at Reel: 052262 Frame: 0001. Assignor(S) Hereby Confirms the Assignment. Dec 20, 2022
From: PARK, CHAE MIN; JO, JI HONG; SHIN, WOONG; LEE, JAE HYUN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 062172/0613 →