IP Library › Assignment 052262/0215
Patent Assignment
Reel/Frame 052262/0215

Assignment of Assignor's Interest

Recorded: 2020-03-30 Pages: 3
Assignors
KIM, DONG YEONG
Executed: 2020-02-20
SHIN, WOO CHUL
Executed: 2020-02-20
JO, JI HONG
Executed: 2020-02-20
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Electronic Component for Enhanced Moisture Resistance and Bending Strength
Application: 16/834,202 →
Publication: US 2021/0065985