Patent Assignment
Reel/Frame 052264/0550
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 10
Assignors
MALLIK, DEBENDRA
Executed: 2020-03-24
CHANG, JE-YOUNG
Executed: 2020-03-23
VISWANATH, RAM
Executed: 2020-03-26
BOZORG-GRAYELI, ELAH
Executed: 2020-03-25
AL MOHAMMAD, AHMAD
Executed: 2020-03-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Ic Die and Heat Spreaders with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects