Patent Assignment
Reel/Frame 052265/0257
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 7
Assignors
ISLAM, RABIUL
Executed: 2020-02-10
WANG, CHUEI-TANG
Executed: 2020-02-20
RUSU, STEFAN
Executed: 2020-01-31
SONG, WEIWEI
Executed: 2020-01-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same