Patent Assignment
Reel/Frame 052266/0204
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 12
Assignors
WANG, MINGZHU
Executed: 2020-02-28
ZHAO, BOJIE
Executed: 2020-02-25
TANAKA, TAKEHIKO
Executed: 2020-03-01
GUO, NAN
Executed: 2020-02-25
CHEN, ZHENYU
Executed: 2020-02-18
JIANG, HENG
Executed: 2020-02-25
LUAN, ZHONGYU
Executed: 2020-02-25
XI, FENGSHENG
Executed: 2020-02-25
CHEN, FEIFAN
Executed: 2020-02-25
DING, LIANG
Executed: 2020-02-25
Assignee
NINGBO SUNNY OPOTECH CO., LTD.
66-68, SHUNYU ROAD, YUYAO,, NINGBO, ZHEJIANG, 315400, CHINA
Covered Property
(1)
Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof
Application:
16/737,863 →
Publication:
US 2020/0218034