Patent Assignment
Reel/Frame 052266/0235
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 6
Assignors
HUANG, CHI-MING
Executed: 2020-03-13
HUANG, PING-KANG
Executed: 2020-03-13
CHIU, SAO-LING
Executed: 2020-03-13
HOU, SHANG-YUN
Executed: 2020-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof