Patent Assignment
Reel/Frame 052266/0250
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 4
Assignors
TSAI, CHUNG-HAO
Executed: 2020-03-10
YU, CHEN-HUA
Executed: 2020-03-10
WANG, CHUEI-TANG
Executed: 2020-03-10
CHEN, WEI-TING
Executed: 2020-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same