Patent Assignment
Reel/Frame 052270/0907
Assignment of Assignor's Interest
Recorded: 2020-03-31
Pages: 3
Assignors
CHIANG, KUO-CHENG
Executed: 2020-02-19
JU, SHI-NING
Executed: 2020-02-19
CHEN, GUAN-LIN
Executed: 2020-02-19
WANG, CHIH-HAO
Executed: 2020-03-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Semiconductor Device with Stressor