Patent Assignment
Reel/Frame 052273/0993
Assignment of Assignor's Interest
Recorded: 2020-03-31
Pages: 4
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, GYEONGGI-DO, ICHEON-SI, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Using Wires and Stacked Semiconductor Package