Corrective Assignment to Correct the Error in a Cover Sheet Previously Recorded on Reel 045941 Frame 0076. Assignor(S) Hereby Confirms the Correction of the Cover Sheet Regarding the Name of Inventor Fee Li Lie, as It Appears on Filed Assignment.

Recorded: 2020-03-31 Pages: 10

Assignors

SONG, YI

Executed: 2018-05-18

STRANE, JAY W.

Executed: 2018-05-23

MILLER, ERIC

Executed: 2018-05-18

LIE, FEE LI

Executed: 2018-05-18

CONTI, RICHARD A.

Executed: 2018-05-20

Assignee

NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504

Covered Property (1)

Dual Width Finned Semiconductor Structure

Patent: 10,672,668 →

Application: 15/993,419 →

Publication: US 2019/0371678

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.