Patent Assignment
Reel/Frame 052297/0834
Assignment of Assignor's Interest
Recorded: 2020-04-02
Pages: 5
Assignors
CHEN, YANG-CHE
Executed: 2019-11-22
LIANG, VICTOR CHIANG
Executed: 2019-11-22
LIN, CHEN-HUA
Executed: 2019-11-22
LIU, CHWEN-MING
Executed: 2019-11-22
TSENG, HUANG-WEN
Executed: 2019-11-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device with Enhanced Thermal Dissipation and Method for Making the Same