IP Library › Assignment 052303/0894
Patent Assignment
Reel/Frame 052303/0894

Assignment of Assignor's Interest

Recorded: 2020-04-03 Pages: 4
Assignors
LIM, BONGSOON
Executed: 2020-03-03
BYEON, DAESEOK
Executed: 2020-03-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Three-Dimensional Semiconductor Devices
Application: 16/835,484 →
Publication: US 2021/0074717