Patent Assignment
Reel/Frame 052309/0137
Assignment of Assignor's Interest
Recorded: 2020-04-03
Pages: 3
Assignors
CHUNG, WONSUK
Executed: 2020-04-01
BAIK, JONGMIN
Executed: 2020-04-01
LEE, SANGHO
Executed: 2020-04-01
LEE, TAESEOP
Executed: 2020-04-01
LEE, HYERIM
Executed: 2020-04-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Supporting Dual Connectivity and Method of Operating the Same