Patent Assignment
Reel/Frame 052325/0748
Assignment of Assignor's Interest
Recorded: 2020-04-06
Pages: 5
Assignors
CHEN, MING-FA
Executed: 2019-09-06
SHIH, CHAO-WEN
Executed: 2019-09-06
CHEN, HSIEN-WEI
Executed: 2019-09-06
YEH, SUNG-FENG
Executed: 2019-09-06
LIU, TZUAN-HORNG
Executed: 2019-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package and Manufacturing Method of Reconstructed Wafer