Patent Assignment
Reel/Frame 052333/0069
Assignment of Assignor's Interest
Recorded: 2020-04-07
Pages: 3
Assignor
KAMIMURA, DAIGI
Executed: 2020-01-20
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-Transitory Computer-Readable Recording Medium