Patent Assignment
Reel/Frame 052337/0652
Assignment of Assignor's Interest
Recorded: 2020-04-08
Pages: 4
Assignors
YOUNG, BO-FENG
Executed: 2020-02-05
YEONG, SAI-HOOI
Executed: 2020-02-05
CHUI, CHI-ON
Executed: 2020-02-12
YAO, CHIEN-NING
Executed: 2020-02-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same