Patent Assignment
Reel/Frame 052365/0374
Assignment of Assignor's Interest
Recorded: 2020-04-10
Pages: 5
Assignors
TUNGA, KRISHNA R.
Executed: 2020-04-01
WEISS, THOMAS
Executed: 2020-04-01
ARVIN, CHARLES LEON
Executed: 2020-04-01
SINGH, BHUPENDER
Executed: 2020-04-01
QUINLAN, BRIAN W.
Executed: 2020-04-09
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Enlarged Conductive Pad Structures for Enhanced Chip Bond Assembly Yield