Patent Assignment
Reel/Frame 052366/0005
Assignment of Assignor's Interest
Recorded: 2020-04-10
Pages: 7
Assignors
LEE, JANGWOO
Executed: 2020-02-25
SHIM, JONGBO
Executed: 2020-02-25
KIM, JI HWANG
Executed: 2020-02-25
KONG, YUNGCHEOL
Executed: 2020-02-25
KIM, YOUNGBAE
Executed: 2020-02-25
KIM, TAEHWAN
Executed: 2020-02-25
MA, HYUNGLAK
Executed: 2020-02-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Device