Patent Assignment
Reel/Frame 052366/0790
Assignment of Assignor's Interest
Recorded: 2020-04-10
Pages: 4
Assignors
CHENG, YUN-WEI
Executed: 2020-02-26
CHOU, CHUN-HAO
Executed: 2020-02-26
LEE, KUO-CHENG
Executed: 2020-02-27
CHEN, YING-HAO
Executed: 2020-03-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Heat Dissipation Structures
Patent:
10,854,530 →
Application:
16/528,207 →