Patent Assignment
Reel/Frame 052374/0092
Assignment of Assignor's Interest
Recorded: 2020-04-12
Pages: 3
Assignor
OTA, KENJI
Executed: 2020-02-07
Assignee
DOW TORAY CO., LTD.
2-24, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU, TOKYO, 1408617, JAPAN
Covered Property
(1)
Thermally-Conductive Silicone Gel Composition, Thermally-Conductive Member, and Heat Dissipation Structure