Patent Assignment
Reel/Frame 052396/0809
Assignment of Assignor's Interest
Recorded: 2020-04-14
Pages: 5
Assignors
TANG, TZU-CHUN
Executed: 2020-03-27
TSAI, CHUNG-HAO
Executed: 2020-03-30
YU, CHEN-HUA
Executed: 2020-03-31
WANG, CHUEI-TANG
Executed: 2020-03-27
LIN, CHIA-CHIA
Executed: 2020-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Including a Solenoid Inductor Laterally Aside a Die and Method of Fabricating the Same