Patent Assignment
Reel/Frame 052396/0840
Assignment of Assignor's Interest
Recorded: 2020-04-14
Pages: 6
Assignors
HU, HSIEN-PIN
Executed: 2020-03-27
KAO, CHIN-FU
Executed: 2020-03-27
CHENG, LI-HUI
Executed: 2020-03-27
LU, SZU-WEI
Executed: 2020-03-27
WEI, WEN-HSIN
Executed: 2020-03-27
PAN, CHIH-CHIEN
Executed: 2020-03-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same