Patent Assignment
Reel/Frame 052402/0339
Assignment of Assignor's Interest
Recorded: 2020-04-15
Pages: 7
Assignors
CHANG, KUEI-SUNG
Executed: 2020-03-31
TSAI, SHANG-YING
Executed: 2020-03-31
MAO, WEI-JHIH
Executed: 2020-03-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Composite Spring Structure to Reinforce Mechanical Robustness of a Mems Device