Patent Assignment
Reel/Frame 052412/0865
Assignment of Assignor's Interest
Recorded: 2020-04-16
Pages: 7
Assignors
SHIN, SEUNGHUN
Executed: 2020-04-08
JANG, JAEJUNE
Executed: 2020-04-08
PARK, DUKSEO
Executed: 2020-04-08
PARK, SUNWOO
Executed: 2020-04-07
PARK, HOWOO
Executed: 2020-03-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Discrete Decoupling Capacitor and Integrated Circuit Chip Package Including Same