Patent Assignment
Reel/Frame 052423/0263
Assignment of Assignor's Interest
Recorded: 2020-04-16
Pages: 7
Assignors
NAKAMURA, TOMONORI
Executed: 2020-01-10
MAEDA, TORU
Executed: 2020-01-09
TAKANO, TETSUO
Executed: 2020-01-09
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Mounting Apparatus and Method for Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.