Patent Assignment
Reel/Frame 052423/0500
Assignment of Assignor's Interest
Recorded: 2020-04-17
Pages: 4
Assignors
LAI, JIUN-YEN
Executed: 2020-04-13
HUANG, YU-TING
Executed: 2020-04-13
SHEN, HSING-LUNG
Executed: 2020-04-13
LIU, TSANG-YU
Executed: 2020-04-13
WU, HUI-HSIEN
Executed: 2020-04-13
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD.,, JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Optical Chip Package and Method for Forming the Same