Patent Assignment
Reel/Frame 052424/0332
Assignment of Assignor's Interest
Recorded: 2020-04-17
Pages: 11
Assignors
HAMADA, MITSUYOSHI
Executed: 2020-02-05
FURUSAWA, FUMIO
Executed: 2020-02-07
IKEZAWA, RYOICHI
Executed: 2020-02-09
TAKEMIYA, KEIZO
Executed: 2020-02-05
BABA, TORU
Executed: 2020-02-10
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin Molding Material for Sealing and Electronic Component Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →