Patent Assignment
Reel/Frame 052425/0306
Assignment of Assignor's Interest
Recorded: 2020-04-17
Pages: 7
Assignors
CHANG, YAO-WEN
Executed: 2017-10-19
HSU, CHERN-YOW
Executed: 2017-10-19
TSAI, CHENG-YUAN
Executed: 2017-10-19
THEI, KONG-BENG
Executed: 2017-10-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Film Scheme for Bumping