Patent Assignment
Reel/Frame 052466/0272
Assignment of Assignor's Interest
Recorded: 2020-04-22
Pages: 4
Assignor
HU, SIPING
Executed: 2020-04-16
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, 430000, CHINA
Covered Property
(1)
Metal-Dielectric Bonding Method and Structure