Patent Assignment
Reel/Frame 052481/0220
Assignment of Assignor's Interest
Recorded: 2020-04-23
Pages: 4
Assignors
YU, LI-ZHEN
Executed: 2020-04-07
HUANG, LIN-YU
Executed: 2020-04-07
CHUANG, CHENG-CHI
Executed: 2020-04-07
LIN, YU-MING
Executed: 2020-04-07
WANG, CHIH-HAO
Executed: 2020-04-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Via structure having a Metal Hump for Low Interface Resistance