Patent Assignment
Reel/Frame 052483/0722
Assignment of Assignor's Interest
Recorded: 2020-04-23
Pages: 6
Assignors
CHIEN, CHIN-HER
Executed: 2020-02-27
HUANG, PO-HSIANG
Executed: 2020-02-27
YEH, CHENG-HUNG
Executed: 2020-02-27
WANG, TAI-YU
Executed: 2020-02-27
TSAI, MING-KE
Executed: 2020-02-27
TSAI, YAO-HSIEN
Executed: 2020-03-10
LIN, KAI-YUN
Executed: 2020-03-10
HUANG, CHIN-YUAN
Executed: 2020-03-10
LIU, KAI-MING
Executed: 2020-03-10
CHANG, FONG-YUAN
Executed: 2020-03-10
LIU, CHIN-CHOU
Executed: 2020-02-27
CHENG, YI-KAN
Executed: 2020-03-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Package Structure and Method for Forming the Same