IP Library Assignment 052488/0613
Patent Assignment
Reel/Frame 052488/0613

Assignment of Assignor's Interest

Recorded: 2020-04-24 Pages: 5
Assignors
HIGASHIUCHI, TOMOKO
Executed: 2019-11-06
MARUYAMA, NAOKI
Executed: 2019-11-06
FUKUDA, KAZUMASA
Executed: 2019-11-07
TAKEZAWA, YOSHITAKA
Executed: 2019-11-07
KATAGI, HIDEYUKI
Executed: 2019-11-12
NAKAMURA, YUKI
Executed: 2019-11-06
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Application: 16/758,972 →
Publication: US 2020/0325398
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 21, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059746/0160 →
Change of Name Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment. Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →