IP Library Assignment 059746/0160
Patent Assignment
Reel/Frame 059746/0160

Change of Name

Recorded: 2022-04-21 Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-15
Assignee
SHOWA DENKO MATERIALS CO., LTD.
1-9-2, MARUNOUCHI, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Application: 16/758,972 →
Publication: US 2020/0325398
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 24, 2020
From: HIGASHIUCHI, TOMOKO; MARUYAMA, NAOKI; FUKUDA, KAZUMASA; TAKEZAWA, YOSHITAKA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052488/0613 →
Change of Name Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment. Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →