Patent Assignment
Reel/Frame 052490/0120
Assignment of Assignor's Interest
Recorded: 2020-04-24
Pages: 4
Assignor
MATSUURA, YOSHINORI
Executed: 2020-02-07
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Ultra-Thin Copper Foil, Ultra-Thin Copper Foil with Carrier, and Method for Manufacturing Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.