Patent Assignment
Reel/Frame 052495/0079
Assignment of Assignor's Interest
Recorded: 2020-04-24
Pages: 3
Assignor
KAO, CHIN-LI
Executed: 2020-04-23
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package Structure and Method for Manufacturing the Same