Patent Assignment
Reel/Frame 052499/0877
Assignment of Assignor's Interest
Recorded: 2020-04-27
Pages: 7
Assignors
LEE, HYUEKJAE
Executed: 2020-03-19
KIM, JIHOON
Executed: 2020-03-19
SUH, JIHWAN
Executed: 2020-03-19
LEE, SO YOUN
Executed: 2020-03-19
HWANG, JIHWAN
Executed: 2020-03-19
KIM, TAEHUN
Executed: 2020-03-19
HONG, JI-SEOK
Executed: 2020-03-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and a Method for Manufacturing the Same