Patent Assignment
Reel/Frame 052501/0672
Assignment of Assignor's Interest
Recorded: 2020-04-27
Pages: 7
Assignors
JI, BYOUNGHOON
Executed: 2020-03-04
MAENG, SEOYOUNG
Executed: 2020-03-04
KIM, MINJOON
Executed: 2020-03-04
BAE, JONGYONG
Executed: 2020-03-04
UH, JIHO
Executed: 2020-03-04
LIM, HONGTAEK
Executed: 2020-03-04
HAN, DONGHOON
Executed: 2020-03-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Vacuum Chuck, Substrate Processing Apparatus Including the Same and Related Method of Manufacture