Patent Assignment
Reel/Frame 052506/0609
Assignment of Assignor's Interest
Recorded: 2020-04-27
Pages: 7
Assignors
AKKINEPALLY, PRANEETH KUMAR
Executed: 2020-03-23
TRUONG, FRANK
Executed: 2020-03-23
GAMBA, JASON M.
Executed: 2020-03-25
MAY, ROBERT ALAN
Executed: 2020-03-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Embedded Multi-Die Interconnect Bridge Having a Molded Region with Through-Mold Vias