IP Library › Assignment 052520/0038
Patent Assignment
Reel/Frame 052520/0038

Assignment of Assignor's Interest

Recorded: 2020-04-28 Pages: 3
Assignors
PARK, HEUNG KIL
Executed: 2020-03-23
PARK, HUN GYU
Executed: 2020-03-24
PARK, SE HUN
Executed: 2020-03-24
JI, GU WON
Executed: 2020-03-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONNGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Electronic Component and Board Having the Same Mounted Thereon
Application: 16/860,704 →
Publication: US 2021/0202175
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 5, 2020
From: PARK, HEUNG KIL; PARK, HUN GYU; PARK, SE HUN; JI, GU WON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 052578/0885 →