Patent Assignment
Reel/Frame 052548/0307
Assignment of Assignor's Interest
Recorded: 2020-05-01
Pages: 2
Assignor
CHIU, HSISH-YANG
Executed: 2020-02-17
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST.,, NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Semiconductor Structure Having Void Between Bonded Wafers and Manufacturing Method Tehreof
Application:
16/857,920 →
Publication:
US 2021/0335660