Patent Assignment
Reel/Frame 052551/0079
Assignment of Assignor's Interest
Recorded: 2020-05-01
Pages: 3
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods for Reducing Heat Transfer in Semiconductor Assemblies, and Associated Systems and Devices