Patent Assignment
Reel/Frame 052564/0264
Assignment of Assignor's Interest
Recorded: 2020-05-04
Pages: 2
Assignor
HUANG, TSE-YAO
Executed: 2020-03-06
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Semiconductor Package with Air Gap and Manufacturing Method Thereof