Patent Assignment
Reel/Frame 052583/0240
Assignment of Assignor's Interest
Recorded: 2020-05-05
Pages: 3
Assignors
PARK, HONG-BUM
Executed: 2020-04-17
PARK, JEONG-HYUN
Executed: 2020-04-17
LEE, SUK-WON
Executed: 2020-04-17
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Stacked Semiconductor Chips