Patent Assignment
Reel/Frame 052589/0164
Assignment of Assignor's Interest
Recorded: 2020-05-06
Pages: 4
Assignors
HUANG, YU-LUNG
Executed: 2020-04-07
CHUNG, CHEE-KEY
Executed: 2020-04-07
HSU, YUAN-HUNG
Executed: 2020-04-07
CHEN, CHI-JEN
Executed: 2020-04-07
Assignee
SILICONW ARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Electronic Package and Fabrication Method Thereof