Patent Assignment
Reel/Frame 052590/0017
Assignment of Assignor's Interest
Recorded: 2020-05-06
Pages: 10
Assignors
YANG, LITAO
Executed: 2020-04-15
PULUGURTHA, SRINIVAS
Executed: 2020-05-06
GAO, YUNFEI
Executed: 2020-04-15
TANG, SANH D.
Executed: 2020-04-16
LIU, HAITAO
Executed: 2020-04-15
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1- 525, BOISE, IDAHO, 83716
Covered Property
(1)
Integrated Assemblies having Conductive Material Along Three of Four Sides Around Active Regions, and Methods of Forming Integrated Assemblies